FY2017 supplementary manufacturing grant · Industrial tech

Hiten wins manufacturing subsidy for automated die machining

The ¥10 million grant supports automated electrical-discharge machining for carbide die production.

Hiten was selected for Japan’s FY2017 supplementary manufacturing subsidy, with selections announced on June 29, 2018. The company subsequently received a ¥10 million grant decision on August 23, 2018.

The project introduces automated electrical-discharge machining to improve the efficiency of carbide die production and support expansion into new business areas. Hiten designs and manufactures tooling for cold and hot forging.

Use of funds

Introduce automated electrical-discharge machining for efficient carbide die production

Funding history

Sources

  1. Osaka manufacturing subsidy recipients 2018-06-29maido.or.jp
  2. FY2017 supplementary manufacturing grant decisions: firstcallmaido.or.jp