Hiten wins manufacturing grant for CNC grinding expansion
The Japanese die maker was selected for a manufacturing subsidy to expand its processing capabilities; the project later received a ¥10 million grant decision.
Hiten was selected on September 29, 2014, for Japan’s manufacturing, commerce and services innovation subsidy. The project centred on introducing CNC grinding to work with new materials and broaden the company’s processing capabilities.
The equipment investment was intended to shorten lead times and reduce costs. Hiten designs and manufactures dies and related tooling for cold and hot forging, where precision processing shapes the range of materials and orders it can handle.
The Osaka programme office subsequently approved a ¥10 million grant for the project on November 17, 2014. The award supported the same CNC grinding project selected in September.
Use of funds
Introduce CNC grinding to machine new materials, expand processing capabilities and shorten lead times