Transtreams Technology raises CNY1bn Series B as its next-generation AI video chip returns from fabrication
The Kuaishou spinout expects volume shipments of its new 3D-stacked chip in 2027, building on commercial deployments of its SL200 processor.
Yizhuang Guotou Yitang Shenghe Fund, Qiming Venture Partners and Chaohui Capital co-led the round. Industrial investors Stony Creek Capital, Longxin Venture Capital and Anhui Wenlv Investment participated alongside financial backers and returning shareholders.
Transtreams’ next-generation chip completed tape-out in April and has now returned from fabrication, according to the company’s November 4 interview with 36Kr. The 3D-stacked design and its DiPU computing architecture target the memory, bandwidth and inference-cost demands of generative video. Volume shipments remain planned for 2027.
The company says it has sold close to 100,000 SL200 chips, with deployments at Kuaishou, Alibaba Cloud, Baidu Cloud and Bilibili. Its new product extends that existing video-processing business into AI video generation.
Use of funds
Develop and mass-produce next-generation chips.
Expand into global markets.