Pre-IPO · Hardware
iSABers Group completes Pre-IPO financing with Inno-Chip and AMEC
Semiconductor bonding specialist iSABers Group has completed a Pre-IPO financing round involving industrial investors and existing backers.
iSABers Group announced the completion of a Pre-IPO financing round on 28 October 2026. Inno-Chip, AMEC and a group of semiconductor industry investors and existing backers participated. The amount raised was not disclosed.
The company develops bonding equipment and process services for semiconductor manufacturing. Its equipment supports advanced packaging, high-bandwidth memory, optical communications and wafer-level integration. The financing follows approximately ¥500 million in strategic funding announced in March.
Funding history
Pre-IPO · This roundUndisclosed
Strategic financing~CN¥500M