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iSABers Group
China · Hardware · Industrial tech
iSABers Group develops semiconductor bonding equipment and precision bonding process services.
Product
iSABers Group makes equipment and provides process services for semiconductor bonding. Its systems join wafers, chips and different semiconductor materials for advanced packaging, heterogeneous integration and MEMS sensor production.
Based in Tianjin, the company develops ultra-high-vacuum room-temperature bonding, hybrid bonding and thermocompression systems, alongside customised process services. It combines equipment manufacturing with process development for semiconductor customers.
Funding history
2 rounds · 1 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Pre-IPO | Undisclosed | AMEC — ParticipantInno-Chip — Participant | |
| Strategic financing | ~CN¥500M | AMEC — LeadFortera Capital — LeadBAIC Capital — Participant |
Investors
AMECJoined Pre-IPO · Led Strategic financingInno-ChipJoined Pre-IPOFortera CapitalLed Strategic financingBAIC CapitalJoined Strategic financingCoverage
weeklyWeekly funding picks, 26 October–1 November: chips, GPU loans and aircraft testingOct 28, 2026iSABers Group · Pre-IPOMar 24, 2026iSABers Group · Strategic financingSimilar companies
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