iSABers Group raises approximately ¥500m for semiconductor bonding equipment
AMEC and Fortera Capital co-led the strategic financing to expand iSABers Group’s research, product development and production capacity.
iSABers Group announced on 24 March 2026 that it had completed approximately ¥500 million in strategic financing. AMEC and Fortera Capital co-led the round, BAIC Capital participated, and existing backer Inno Fund made an additional investment.
The company plans to use the funding for core technology research, product development, research and delivery teams, expanded production facilities and international growth. It develops semiconductor bonding equipment and precision process services used in advanced packaging, wafer-level integration and MEMS manufacturing.
Use of funds
Core technology research and development
Bonding equipment product development
Research and delivery team expansion
Production base expansion
International expansion