Funding
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Plug and Play Ventures

Activity from announced rounds

Activity in this selectionOct 16, 2026 · Jul 19, 2026
Rounds participated in
2
Confirmed lead rounds
0
All roles disclosed
New companies
2
First participation on record · 0 follow-on
Funding in participating rounds
$5.4M
2 disclosed · full round size, not this investor’s share

By stage

Pre-seed1
Seed1

By primary sector

Cybersecurity1
Industrial tech1

By country

France1
Germany1

Rounds

2 in this selection
Palma.ai

Palma.ai gives enterprises a governance layer for AI agents, controlling permissions and tools while auditing agents’ actions in connected business systems.

$1.8MPre-seed
Participant
Lightspring

LightSpring develops 3D optical-interconnect manufacturing technology that precisely connects photonic chips, fibers and light sources.

Participant