The company
The French deeptech startup uses 3D lithography to manufacture optical interfaces directly on photonic chips, targeting a packaging process that accounts for around half of a photonic chip’s cost.
The funding
Lightspring, based in Besançon, France, announced €3.1M in Seed financing on September 22, 2026.
Participants include Ovni Capital, Plug and Play Ventures, Atlantic.vc, Concept Ventures, iXcore.