Plug and Play Ventures

Activity from announced rounds

Activity in this selectionFrance · Oct 12, 2026 · Jan 1, 2026
Rounds participated in
2
Confirmed lead rounds
0
All roles disclosed
New companies
2
First participation on record · 0 follow-on
Funding in participating rounds
$3.6M
1 disclosed · full round size, not this investor’s share

By stage

Seed1
Undisclosed1

By primary sector

Industrial tech1
Proptech1

By country

France2

Rounds

2 in this selection
Joe AI

AI agents that handle customer communications and operations for real estate professionals.

€2MUndisclosed
Participant
Lightspring

LightSpring develops 3D optical-interconnect manufacturing technology that precisely connects photonic chips, fibers and light sources.

Participant