Strategic investment · Industrial tech
Tanaka Seimitsu invests in thermal-materials developer U-MAP
The companies will work on cooling modules for power semiconductors.
U-MAP announced an undisclosed equity investment from Tanaka Seimitsu Kogyo on October 15. The investment forms part of a capital and business alliance agreed on September 28.
The partners will combine U-MAP’s Thermalnite materials with Tanaka’s design and manufacturing capabilities to validate cooling components for electric vehicles and data centres. They aim to commercialise the resulting products by 2030.
Use of funds
Thermal-management materials
Cooling-module validation
Funding history
Strategic investment · This roundUndisclosed