Huixi discloses completed Pre-Series B+ financing
The robotics chipmaker included its completed Pre-Series B+ in an October financing announcement supporting new chips and wider deliveries.
Huixi Technology disclosed a completed Pre-Series B+ round on October 22, 2026, alongside completion of its subsequent Series B. The company said the financing would support new high-performance embodied-AI chips and the expansion of commercial deliveries.
Huixi supplies processors, computing modules and software for robot manufacturers. Its R1-based platform powers AgiBot G2 robots, connecting the company’s chip development to deployment in physical machines.
The announcement put Huixi’s total 2026 equity financing above RMB2.5 billion across multiple rounds. It did not separately disclose the Pre-Series B+ amount or allocate the combined investor list to that individual round.
Use of funds
Develop new embodied-AI chips
Expand commercial computing-platform deliveries