Series A+ · Industrial tech
Elead Tech completes Series A+ for semiconductor packaging equipment
Chengchen Venture Capital and Diankong Industrial Investment participated in the financing.
Elead Tech has completed Series A+ financing with investment from Chengchen Venture Capital and Diankong Industrial Investment. The amount was not disclosed.
The Nanjing company makes equipment that removes trapped bubbles and laminates materials during advanced semiconductor packaging. Its systems combine heat, pressure and vacuum to improve process quality.
The financing supports equipment production and technology development as the company expands its packaging solutions.
Use of funds
Expand equipment production and technology development
Funding history
Series A+ · This roundUndisclosed