ET
Elead Tech
China · Industrial tech
Elead Tech makes bubble-removal and vacuum lamination equipment for semiconductor packaging.
Product
Elead Tech develops equipment for removing trapped bubbles and laminating materials during semiconductor packaging. Its systems use controlled heat, pressure and vacuum to improve process consistency and manufacturing yield.
The Nanjing company supplies pressure and vacuum defoaming systems alongside wafer-level vacuum lamination equipment. Its applications include chip attachment, underfill, encapsulation and related packaging processes.
Funding history
1 round · 0 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Series A+ | Undisclosed | Chengchen Venture Capital — ParticipantDiankong Industrial Investment — Participant |
Investors
Chengchen Venture CapitalJoined Series A+Diankong Industrial InvestmentJoined Series A+Coverage
Feb 12, 2026Elead Tech · Series A+Similar companies
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