Kandou AI
Develops high-speed energy-efficient chip-to-chip connectivity solutions for AI systems
$225MSeries A
Role not disclosedSG
SoftBank Group
Activity from announced rounds
Activity in this selectionOct 24, 2026 · Jan 1, 2026
- Rounds participated in
- 2
- Confirmed lead rounds
- — 2 roles undisclosed
- New companies
- 2 First participation on record · 0 follow-on
- Funding in participating rounds
- $1.6B 2 disclosed · full round size, not this investor’s share