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Funding/TYLsemi/Undisclosed

TYLsemi: funding round

TYLsemi delivers standards-based, production-ready chiplets for modern multi-die systems

Oct 4, 2026RoundOS

TYLsemi

Company profile and funding history

Sources

  1. prnewswire.com
Raised
$43M
Round
Undisclosed
Announced
Jul 14, 2026
Sector
Hardware
Headquarters
United States

Investors

    All participants (4)
    • Egis Technology
    • GHOVC
    • Matter Venture Partners
    • Viola Ventures

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