Power delivery at the processor
The design combines multiphase controllers and smart power stages to regulate electricity close to the chip. Its grid-to-core approach treats power delivery as a system, rather than optimising each component in isolation.
From design to silicon
The February financing supported the first chip tape-outs and international expansion. In May, TDK Ventures and the company identified the Series A as $16.7 million, updating the $15 million initially announced.
Where the funding goes
- Chip development and first tape-outs
- International expansion