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SweGaN
Sweden · Hardware
SweGaN supplies gallium-nitride-on-silicon-carbide wafers for manufacturers of radio-frequency and power electronics.
Product
Its QuanFINE process removes the conventional thick buffer layer between the active semiconductor structure and the silicon-carbide substrate. Bringing the hot transistor channel closer to the substrate helps heat escape, addressing a constraint on high-power devices.
The Linköping company supplies foundries, chip designers and system manufacturers. Customers use its materials in telecommunications, radar, satellite communications and power-conversion equipment, with material analysis and device-characterisation services supporting development.
Funding history
1 round · 1 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Series B | $14M | North Ventures — LeadThisbe AB — LeadAtlantic Bridge — ParticipantLifelike Capital Fund LP — ParticipantNavigare Ventures — Participant |